Packaging Architect

The Role

At OLIX, the performance of our technology depends not only on silicon design, but on how effectively that silicon is packaged, integrated, and scaled into products. Packaging is a first-class element of our rack-scale co-design philosophy, and over successive product generations it will become one of our most important sources of system-level differentiation.

The Advanced Packaging Architect will own OLIX's packaging technology direction: defining the packaging architecture and roadmap across current and future products, and delivering the packaging solutions that turn our ASICs into high-performance systems.

The DX-1 provides the foundation, with a well-bounded packaging scope that must be executed to a high standard on an aggressive schedule. Beyond DX-1, our roadmap moves rapidly toward significantly more advanced packaging, with the potential for denser multi-die and chiplet-style integration, 2.5D and 3D architectures, and progressively more advanced optical integration. This role shapes that trajectory and lays the foundation for future products that will fast-follow DX-1.

This is a high-impact role combining hands-on engineering with architectural and strategic ownership. You will lead packaging across the full development flow for DX-1, including package architecture, detailed design, layout, simulation, and product readiness, while simultaneously defining the packaging technology strategy, partner ecosystem, and internal capability that future generations will require. As the programme scales, you will have the opportunity to build the packaging function and team around you.

Skills & Experience

• 10+ years' experience in advanced semiconductor packaging for ASIC or other high-performance products

• Demonstrated ownership of packaging architecture, technology strategy, or roadmap development for complex products

• Deep expertise in front-end package design, including ASIC-to-substrate integration

• Strong experience with 2.5D and/or 3D package architectures, including multi-die and heterogeneous integration

• Strong hands-on capability with package design tools such as Cadence Allegro X APD, Siemens Xpedition, or equivalent

• Experience leading package development across layout, simulation, verification, and release

• Strong PI/SI simulation capability, including package-level signal integrity and power delivery analysis using tools such as Ansys SIwave, Cadence Sigrity, or equivalent

• Experience in substrate design and package-to-board integration

• Experience building packaging capability, processes, or teams, or leading engineers while remaining a hands-on contributor

• Strong working relationships with substrate vendors, OSATs, and foundry packaging organisations

• Good understanding of manufacturability, interconnect technologies, and package reliability

• Strong technical judgement, communication, and problem-solving skills

• Degree in a relevant engineering or physical sciences discipline

Desirable

• Experience with AI accelerators, high-performance compute, networking, or advanced data-centre hardware

• Familiarity with wafer-level packaging and emerging advanced packaging platforms

• Exposure to optical or photonic integration with electronic packaging

• Familiarity with package reliability, qualification, and failure analysis workflows

• Exposure to new product introduction and scaling advanced package technologies into production

Compensation & Equity

• Competitive Salary: commensurate with your experience, skills, and location.

• Equity & Ownership: Meaningful stock options. You're not just joining the mission; you're owning a piece of it.

• Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer an annual Living-Local Bonus if your residence is within 20 minutes of the office.